Purpose

About The Business

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Key Responsibility

1. Own inline metrology performance and control for critical parameters (CD, overlay, film thickness, profile, roughness, stress, RI/n&k as applicable) and ensure stable, accurate measurement to support yield and process windows
2. Develop and maintain metrology sampling plans and control plans (per product/layer/tool), including spec limits, SPC charts, and reaction plans aligned to ramp/HVM needs
3. Lead recipe setup and optimization (e.g., CD-SEM/OCD/ Thickness /ellipsometry, overlay, profilometry): target selection, measurement conditions, automation, throughput vs precision tradeoffs
4. Drive tool matching/correlation across fleets and technologies (tool-to-tool, tool-to-reference, cross-tech correlation); establish baselines and periodic re-correlation schedules
5. Execute MSA activities: GR&R, repeatability/reproducibility, bias/linearity/stability studies; manage calibration and reference standards traceability
6. Monitor and respond to metrology excursions using SPC/FDC: abnormal shifts, drifts, outliers; trigger containment (data quarantine/lot holds as needed) and coordinate recovery with module/equipment teams.
7. Build data correlations between metrology and downstream outcomes (defect density, CP/WAT, D0/yield impact), enabling early warning indicators and yield loss prediction inputs.
8. Drive CIP/BKM for metrology: standard recipes, golden tool strategy, post-PM qualification criteria, preventive maintenance checks, and technician/operator training.
9. Support new metrology tool installs, tech transfer, and ramp by completing tool qualification and production release, defining acceptance criteria, and ensuring sustainable capacity and uptime
10. Travel, as necessary
11. Presentation to internal teams and senior executives
12. Drive cross-functional yield improvement projects and DOEs
13. Apply structured problem-solving and risk tools: FMEA, 8D, and strong RCA to drive effective CAPA and prevent recurrence.
14. Use SPC, FDC, and APC to monitor process health, detect excursions early, and enable data-driven defect/yield control

Qualification

1. M.Tech/M.S. in Chemical Engineering, Electrical/Electronics Engineering, Mechanical Engineering, Materials/Materials Science, or equivalent
2. Strong understanding of analytical/metrology techniques (SEM, FIB, TEM, SIMS, ICP-MS, chromatography, ellipsometry, AFM, refractometry etc.)
3. Deep understanding of Semiconductor wafer Fabrication
4. Proven track record in yield improvement on new and mature technologies
5. Ability to lead cross-functional teams and achieve project completion within timeline and cost targets
6. Ability to work across different cultures and geographies
7. Good team player
8. Innovation and competitive mindset

Experience

1. 7+ years experience in the semiconductor industry
2. Proven track record of successfully developing new technologies into high volume production
3. Proven problem solving skills using design of experiments and analytical tools

Additional Technical Requirements

Competencies