Role Overview:

An NPI Manager in an OSAT (Outsourced Semiconductor Assembly & Test) factory is responsible for managing the introduction of new semiconductor products from development to high-volume manufacturing. This role ensures smooth product qualification, engineering readiness, and production ramp-up while coordinating across cross-functional teams, including customers, engineering, operations, and supply chain.

Key Responsibilities:

1. NPI Project Management & Execution

   •   Lead end-to-end NPI programs, from customer engagement to mass production ramp.

   •   Define NPI project milestones, timelines, and deliverables in alignment with customer expectations.

   •   Ensure DFM (Design for Manufacturability) and DFx (Design for Excellence) principles are applied early in the development phase.

   •   Manage multiple concurrent product qualifications and engineering builds (EVT, DVT, PVT) across OSAT sites.

2. Cross-Functional Coordination

   •   Serve as the primary interface between customers and OSAT manufacturing teams for NPI activities.

   •   Work closely with R&D, process engineering, quality, planning, and procurement teams to resolve technical and operational challenges.

   •   Align with test engineering and assembly engineering teams to optimize test flow, package assembly processes, and yield improvement strategies.

   •   Ensure smooth handover from NPI to volume production with stable yields and optimized cost.

3. Product & Process Qualification

   •   Drive product and package qualification (JEDEC, AEC-Q100 for automotive, etc.) in collaboration with quality and reliability teams.

   •   Review FA (Failure Analysis), DOE (Design of Experiments), and yield analysis results to optimize process windows.

   •   Ensure compliance with customer and industry standards (e.g., IPC, ISO9001, IATF 16949 for automotive applications).

4. Manufacturing Readiness & Yield Optimization

   •   Oversee the first article builds, engineering samples, and production ramp readiness.

   •   Work with industrial engineering and operations to ensure factory capacity, tool readiness, and process stability.

   •   Identify and mitigate risks related to yield excursions, process variation, and supply chain disruptions.

5. Cost & Efficiency Improvement

   •   Drive cost-effective NPI execution, ensuring BOM (Bill of Materials), cycle time, and process costs are optimized before volume production.

   •   Identify opportunities for cycle time reduction, material cost savings, and process automation.

   •   Ensure smooth transition from NPI to high-volume manufacturing with minimal yield loss and rework.

Qualifications & Skills:

Education:

   •   Minimum of Bachelor’s or Master’s degree in Engineering (Electronics, Mechanical, Industrial, or Manufacturing) or a related technical field.

Experience:

   •   Minimum of 10+ years of experience in semiconductor packaging, assembly, or test, with at least 3 years in an NPI leadership role.

   •   Experience in OSAT, IDM, or semiconductor supply chain environments.

   •   Strong understanding of advanced packaging technologies (FCBGA, WLCSP, SiP, 2.5D/3D ICs, automotive, or high-reliability applications).

 Technical Skills:

   •   Project Management: Expertise in Agile, PMP, or Six Sigma methodologies for NPI execution.

   •   Manufacturing & Process Engineering:

      •   Experience with flip-chip, wire bonding, die attach, molding, and test process flows.

      •   Knowledge of DFM, SPC (Statistical Process Control), DOE (Design of Experiments), and FA (Failure Analysis).

   •   Reliability & Qualification Standards: Familiarity with JEDEC, AEC-Q100, MIL-STD, and IPC requirements.

   •   Data Analytics & Yield Analysis: Proficiency in JMP, Minitab, Python, SQL, or other statistical tools.

 Soft Skills:

   •   Strong leadership and communication skills to manage cross-functional teams and customer interactions.

   •   Problem-solving mindset with the ability to manage multiple projects under tight deadlines.

   •   Customer-focused approach to ensure seamless collaboration between OSAT and semiconductor clients.

Preferred Experience (Bonus):

   •   Experience in high-reliability or automotive semiconductor manufacturing (SEMI standards, IATF 16949, ISO 26262, ASPICE).

   •   Working knowledge of SAP, MES, and smart factory tools for NPI tracking and production scaling.

• Experience in both PCBA/SMT and IC packaging preferred
• Knowledge in IATF and APQP process
• Exposure to AS9100 with electronics manufacturing preferred