As the Engineer of Flip-Chip Assembly, you will be responsible for overseeing and driving all flip-chip processes within a semiconductor manufacturing facility. Your role involves managing flip-chip equipment and operations, implementing process improvements, ensuring robust quality standards, and collaborating with cross-functional teams to meet overall production and yield targets. 

Key Responsibilities: 

• Extensive experience in flip-chip assembly processes within the semiconductor industry, with a proven track record of leadership. 

• In-depth knowledge of various flip chip process( 

• Set up and operate flip-chip bonders and associated assembly tools according to established procedures. 

• Lead and manage the flip-chip engineering and production team, providing guidance, coaching, and support. 

• Foster a collaborative and high-performance work environment within the flip-chip department. 

• Conduct inspections of flip-chip joints, underfill, and overall package reliability to ensure compliance with quality standards and specifications. 

• Troubleshoot and resolve issues related to flip-chip processes, collaborating with CFT teams to enhance efficiency, quality, and yield. 

• Maintain accurate records of production activities, including process parameters, equipment settings, and inline quality data. 

• Contribute to the creation and periodic update of standard operating procedures (SOPs) related to flip-chip processes. 

• Collaborate with engineering teams to implement improvements and innovations in flip-chip technology, materials, and equipment. 

• Establish and enforce quality control measures for flip-chip operations. 

• Ensure compliance with industry standards, reliability requirements, and customer specifications. 

• Perform routine and preventive maintenance on flip-chip equipment to ensure optimal performance. 

• Develop and implement strategic plans for the flip-chip department in alignment with organizational objectives. 

• Identify opportunities for cost savings, throughput enhancements, and adoption of advanced packaging technologies. 

• Collaborate with other department heads, including engineering, production, and quality assurance, to ensure seamless integration of upstream and downstream processes. 

• Communicate effectively with stakeholders to address challenges and optimize workflows. 

• Identify and address skill gaps within the flip-chip team through structured training plans. 

• Ensure complete and accurate documentation of flip-chip processes, materials, equipment settings, and quality control data. 

• Drive continuous improvement initiatives through data analysis and cross-functional coordination. 

• Generate reports on departmental performance, yield trends, and key operational metrics. 

Requirements: 

• Minimum 5 years of experience in the semiconductor manufacturing industry. 

• Bachelor’s degree in Mechanical, Electronics, or Electrical Engineering. 

• Strong analytical and problem-solving skills. 

• Excellent communication and interpersonal skills. 

• Demonstrated ability to lead and motivate a diverse team.