IC Packaging Quality Lead (EOL & QA Test)

Location: Jagiroad, Assam
Posting Status: Open

Role Summary

The IC Packaging Quality Lead (EOL & QA Test) is responsible for leading End‑of‑Line (EOL) process quality and test strategy in a high‑volume OSAT environment. This role ensures robust product quality, test coverage, and outgoing reliability through close collaboration with OSAT partners, internal product engineering, and cross‑functional teams.

Key Responsibilities

EOL Process Ownership

• Lead all End‑of‑Line (EOL) processes including final test, visual inspection, marking, packing, and tape & reel.
• Define and optimize EOL workflows, procedures, and specifications to ensure consistent quality and throughput.
• Conduct EOL process audits, identify gaps, and drive corrective and preventive actions (CAPA).

Quality Assurance & Test Leadership

• Own the QA strategy for IC packaging, including quality planning, PFMEA, and compliance with industry standards.
• Define and sustain test coverage, test limits, and quality control plans across OSAT sites.
• Perform yield analysis, test data reviews, failure traceability, and root cause analysis for test escapes or quality excursions.
• Lead Material Review Board (MRB) activities and support containment and disposition actions.

OSAT Partner Management

• Act as the primary technical and quality interface with OSAT assembly and test partners.
• Ensure OSAT adherence to defined process controls, quality requirements, and test execution standards.
• Review and approve OSAT qualification packages, process changes, and engineering validation results.

New Product Introduction (NPI)

• Support NPI programs by defining EOL readiness, test program maturity, and qualification strategies.
• Drive DFT / DFM / DFx discussions to ensure scalability, manufacturability, and test robustness.
• Oversee pilot runs, engineering builds, and ramp‑up to high‑volume manufacturing (HVM).

Data‑Driven Quality Improvements

• Use statistical tools (SPC, DOE, Minitab/JMP) to identify trends and drive continuous improvement.
• Develop dashboards to track yield, outgoing quality, test metrics, and customer returns.
• Lead deep‑dive analysis on CPK, OEE, and test equipment correlations (GR&R).

Compliance & Documentation

• Ensure compliance with JEDEC, IPC, AEC‑Q100, and customer‑specific requirements.
• Maintain QMS documentation including Control Plans, SOPs, Work Instructions, and IQC/OQC standards.
• Support customer and certification audits, providing technical justifications as required.

Essential Attributes

• Strong knowledge of EOL processes (final test, marking, packing, visual inspection).
• Solid background in QA methodologies and quality systems.
• Hands‑on experience in failure analysis, DOE, and root cause methodologies.

Qualifications

• Bachelor’s or Master’s degree in Materials, Mechanical, Electronics, Packaging, or Manufacturing Engineering (or related field).

Experience

• 10+ years of experience in semiconductor packaging, OSAT operations, or IC test engineering.