Position Overview:

The Line Quality Technician operates within a semiconductor IC backend manufacturing and packaging environment and is responsible for in‑process and end‑of‑line quality control activities on the production line. 
The role focuses on ensuring product quality across IC assembly, packaging, and singulation processes by performing inspections, identifying non‑conformances, and supporting corrective actions in real time. 

Responsibilities:

• Perform in‑process and end‑of‑line quality control inspections at various stages of semiconductor packaging production. 

• Execute inspections on the production line to identify defects and deviations from defined process and quality requirements. 

• Follow established quality control procedures to detect product and process non‑conformances. 

• Collaborate with cross‑functional teams (production, engineering, quality) to address and resolve quality issues promptly. 

• Conduct statistical analysis and root cause analysis to identify defect trends and improvement opportunities. 

• Monitor and evaluate line processes to ensure compliance with industry standards, customer requirements, and internal specifications. 

• Implement and maintain quality documentation, including inspection results and control records. 

• Work closely with production line teams to provide real‑time feedback and support continuous improvement initiatives. 

• Conduct line audits to verify adherence to quality control protocols and procedures. 

• Provide training and guidance to production personnel on quality control practices and inspection standards. 

• Support cross‑functional collaboration to integrate quality controls into new product or package introductions. 

Qualifications:

• Bachelor’s degree or Diploma in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field. 

• Hands‑on experience with quality control tools (SPC, FMEA, MSA, 8D, 7QC tools). 

• Minimum 3 years of relevant experience in the semiconductor industry, with exposure to:  

• • Plasma cleaning 

• • Molding 

• • Laser marking 

• • Saw / Punch singulation 

• • Plating and buffing 

• • AOI 

• • Pick & Place inspection 

• Experience performing Laser marking FAI, package dimension measurement, wettability checks, and AOI defect assessment. 

• Strong knowledge of ISO 9001 and IATF 16949 standards. 

• Familiarity with statistical tools such as JMP or Minitab. 

• In‑depth knowledge of IC packaging and backend processes.