Key Responsibilities:

1. NPI Planning & Project Execution

• Lead NPI Activities from design phase to mass production phase for SMT & Box Assembly Processes.
• Evaluate Product designs (DFM) and provide inputs/feedback to Design Team / Customers.
• Prepare NPI Project Plans, timelines & deliverables.
• Conduct feasibility studies for new processes & Products.
• Provide complete NPI documentation for customer approval.

2. New Model Readiness

• Develop and maintain all process documentation, work instructions & SOPs.
• All new models trail pre-readiness (EVT/ DVT / PVT).
• Create SMT Programs for Pick n Place/Mounter, SPP, SPI, AOI & Reflow oven based on Gerber, CAD data & BOM.
• Define & develop jigs/ fixtures and ergonomic tools for SMT & Box Assembly operations.
• Define optimal SMT parameters (Solder Paste type, Stencil design, Reflow Profile, Component Placement rule etc. )
• Develop & Validate reflow Profiles for lead free processes.
• Drive First Article Inspection and resolution of SMT related defects.
• Develop process for Wave Soldering, Selective Soldering, assembly line setup, testing & packaging.
• Optimize cycle times and improve process efficiency during NPI trails

3. Quality Excellence

• Accountable for first pass yield, final yield and field reliability.
• Lead root cause analysis for yield excursions using FMEA, DOE and failure analysis during NPI Trails.
• Ensure zero critical quality escapes at launch.

4.  Operational Excellence & Cost Optimization

• Identify cost down opportunities (Using 4M Man, Method, Machine & Material)
• To ensure Proper line setup & Program version management during NPI.
• To ensure compliance with ESD, Safety & IPC standards.

5. Customer & Stakeholder Engagement

• Serve as a technical NPI member for customers.
• Will be technical team member for customer reviews, technology discussions and risk mitigation plans.

6. System Integration

• Collaborate with IT teams to connect automation with MES platforms.
• Ensure seamless data flow for production monitoring and traceability.

Key Deliverables & KPI

• Ontime Product Launch & First time right
• First Pass Yield and Ramp to Volume Timeline
• NPI Success Rate
• Cost to target achievement
• Customer satisfaction and audit outcomes during NPI Phase.

Required Qualifications

• Bachelor / master in related Engineering Discipline (Preferred Mechanical / Industrial / Electronics)
• 5-8 years’ experience in in SMT + Box Assembly NPI within EMS, Electronics Manufacturing, Automotive Electronics, Consumer Electronics, or similar industry.
• Expertise in SMT Processes, Reflow profiling, Stencil design, and Soldering technologies.
• Ability to interpret Gerber files, schematics, and PCB design documents.
• Knowledge of CAD/CAM tools for SMT programming & Knowledge of DFM/DFT guidelines.
• Working Knowledge & Handson experience on SMT Machines Screen Print , Pick n Place , Reflow & AOI.
• Experience in high volume manufacturing environment.
• Strong understanding of IPC standards (IPC‑A‑610, J‑STD‑001, IPC‑7351).
• Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE )