• Lead end-to-end program management of complex semiconductor assembly and test projects, including new product introductions (NPIs), capacity expansions, and process improvements. 

• Develop and manage detailed project plans, timelines, and resource allocation aligned with business goals and customer requirements. 

• Coordinate cross-functional teams including engineering, manufacturing, quality, procurement, and supply chain to ensure smooth project execution. 

• Act as the primary point of contact for key customers, managing expectations and communications regarding project status, risks, and mitigation plans. 

• Identify and mitigate program risks and issues proactively to minimize impact on schedule and cost. 

• Drive continuous improvement initiatives related to process efficiency, yield enhancement, and cost reduction. 

• Ensure compliance with industry standards, customer-specific requirements, and internal quality systems. 

• Manage program financials, including budget tracking, cost forecasting, and reporting. 

• Mentor and guide junior program managers and team members to foster professional growth and project success. 

Qualifications: 

• Bachelor’s degree in engineering, Electronics, or related technical field; MBA or PMP certification preferred. 

• 12+ years of program or project management experience in semiconductor assembly, test, or related manufacturing environment. 

• Proven track record managing complex, cross-functional projects manufacturing industry. 

• Excellent communication, leadership, and stakeholder management skills. 

• Proficient in project management tools and methodologies (e.g., MS Project, Agile, Lean Six Sigma).