About The Business

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Role Summary

The NPI Quality Lead – OSAT is responsible for end‑to‑end quality planning and execution during new product introduction at external assembly & test (OSAT) partners. This role drives product and process qualification, builds robust control plans, ensures readiness for ramp, and achieves target DPPM/FPY through data‑driven problem solving. You will be the single‑threaded owner for NPI quality at OSAT—leading gates, aligning design/manufacturing/test stakeholders, and ensuring flawless launch to mass production (MP).

• Lead phase‑gate reviews (e.g., PRQ/POR/ES/CS/MP) and drive issue closure across design, packaging, test, and supplier teams.
• Define CTQs/CTPs, PPV/FAI criteria, golden lot strategy, and qualification lots (ES/CS/MP).
• Align acceptance criteria with product requirements (e.g., performance, reliability, package integrity, test coverage).

• Validate OSAT readiness for assembly & test flows (e.g., wafer sort handoff, die attach, wire bond / flip‑chip, mold, singulation, final test, burn‑in).
• Review and approve OSAT process documentation: traveller/routers, work instructions, control charts, change management procedures, and escape prevention controls.
• Implement robust SPC (control charts, control limits, reaction plans) for critical steps; drive MSA (GR&R) for inline and end‑of‑line measurements.
• Ensure material control (lots, traceability, moisture sensitivity, bake, MSD handling, labeling, pack‑out).

• Plan and execute package/product qualification per target standards and customer segment:
  • Automotive: AEC‑Q100/Q104 alignment, IATF 16949 processes, PPAP‑like evidence pack.
  • Industrial/Consumer: JEDEC JESD47/22/94 as applicable.
• Define qual matrices, sample sizes, and acceptance criteria; assess results (e.g., HTOL, HAST/uHAST, TC, THB, BHAST, AC, drop, warpage/co‑planarity, BIB/burn‑in).
• Coordinate FA (FIB/SEM/CSAM/X‑ray/decap) and drive 8D for any qual test failures with clear containment, corrective and preventive actions.

• Partner with Test Engineering to ensure test coverage, guard bands, OBA/OLA, correlation, and outlier screening are adequate for NPI risk profile.
• Monitor DPPM, FPY, bin paretos, retest/rework, drift and excursions; lead DOE and root‑cause analysis to drive yield up and escapes down.
• Build escape prevention and early‑warning systems (e.g., SPC triggers, stop‑ship criteria, deviation controls, recipe locks, recipe checksum audits).

• Own the NPI Quality Pack: Control Plan, PFMEA, MSA studies, SPC control setup, qualification report, FA reports, deviations, 8D records, and readiness checklist.
• Ensure compliance to QMS (e.g., ISO 9001; Automotive: IATF 16949 core tools—APQP/PPAP, MSA, SPC, FMEA, 8D).
• Assess and approve OSAT PCNs; manage ECN/PDN/PCN impacts to customers and internal stakeholders.

• Act as the quality voice for NPI with Design, Pkg Eng, Test Eng, Reliability, Supplier Quality, and Operations.
• Support customer audits, qualification evidence packs, and early customer samples/CS trials with rapid feedback loops.
• Provide executive‑level updates on NPI quality risk, readiness, and mitigation plans.

• Strong command of quality tools: PFMEA/DFMEA, Control Plans, MSA (GR&R), SPC (X‑bar/R, IMR, Cpk/Ppk), DOE, 8D/5Why, Ishikawa.
• Hands‑on experience with reliability/qualification per JEDEC/AEC, and FA workflows (CSAM, X‑ray, SEM/FIB, decap, SAM/warpage).
• Data analysis proficiency (e.g., Minitab/JMP; SQL/Python a plus).
• Excellent communication and leadership; capable of influencing OSAT teams and cross‑functional stakeholders.
• Experience with layered process audits (LPA), process capability studies for advanced packaging (FC, WLCSP, SiP).
  
  

Qualifications

Bachelor’s degree in Engineering (Electrical, Electronics, Materials, Mechanical, Industrial) or related.

Desired Experience Level 

10+ years in semiconductor manufacturing/assembly/test quality, and in NPI and supplier/OSAT management.