Job Description: SMT Process Engineering (Integrated System Packaging) 

Position: SME – Pick n Place / Mounter 

Location: Jagi Road, Assam 

Role Overview: 

SME -  Pick n Place / Mounter  is responsible for overseeing, optimizing & continuously improving  processes to ensure on-time manufacturing with high quality of all ISP Products.  Also to handle end to end machine setup , programming , trouble shooting and process optimization in PCB assembly 

The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams. 

Key Responsibilities: 

1. Technology & Process Setup  

• Define and maintain all process windows, control plans & CTQ across all products of PnP. 

• Setup, Operate, Programming & Optimizing PnP machines.  

• Conduct DOE & Process validation for new products and materials. 

• Perform feeder loading , nozzle selection & calibration. 

• Optimize component placement accuracy and speed. 

• Create & modify machine programs using online/offline SW. 

• Optimize cycle time and improve placement efficiency. 

• Perform Penalization and coordinate transformation. 

• Validate BOM , Centroid file and Gerber data before production. 

2. New Model Readiness 

• Develop & Maintain Process documentation, WIs & SOPs (Pick n Place / Mounter) 

• All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation. 

• Load & verify machine programs for New Product Trail. 

• Conduct First Article Inspection. 

• Partner with NPI, TDG to ensure DFMEA and PFMEA of Pink n Place / Mounter. 

• Ensure proper solder paste reflow per component and PCB design requirements 

• Ensure smooth technology transfer from development to production. 

• Own ramp-up metrics: yield learning curve, cycle time, scrap reduction. 

3. Quality Excellence 

• Accountable for first pass yield, final yield and field reliability. 

• Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis. 

• Monitor production yield , defect rates , cycle time and implement corrective / preventive actions. 

• Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints, misalignment , missing components and solder balls. 

• Partner with Quality team to address customer returns, audits and escalations. 

• Analyze following  defects ( Identify root causes of defects like tombstoning , misalignment , missing components etc. ) and implement corrective actions 

• Monitor Placement Quality and defect rates. 

• Maintain Process documentation & Production reports. 

4.  Operational Excellence & Cost Optimization 

• Own cost of ownership and productivity improvement initiatives. 

• Drive Cycle time and line balancing improvements. 

• Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing ) 

• To ensure Proper line setup , programming , Program version management ( Pick n Place/Mounter ) 

• To ensure compliance with ESD , Safety& IPC standards. 

• Meet daily production targets & OEE goals 

• Coordinate with production planning , quality & maintenance teams 

• Diagnose and resolve machine alarms and placement defects 

• Handle feeder related issues , vision alignment errors & nozzle problems 

• Minimize downtime & improve machine utilization 

5. Customer & Stakeholder Engagement 

• Serve as a technical team member for customers on PCBA Process Topics. 

• Will be technical team member for customer reviews, technology discussions and risk mitigation plans. 

Key Deliverables & KPI 

• First Pass Yield , RTY and Reliability Performance 

• Productivity Improvement , Production Target Vs Actual Achievement 

• Cost Optimization 

• Customer satisfaction and Audit outcomes. 

• Placement Accuracy 

Required Qualifications 

• Bachelor in related Engineering Discipline (Preferred Electronics Engineering)  

• 10-12 years’ hands on experience in SMT industry in a similar role ( PnP Programming & Optimization ) 

• Experience in high volume manufacturing environment. 

• Hands on knowledge of PnP machines ( ASMPT / Fuji / Panasonic ) 

• Deep Understanding of solder paste behavior & thermal profiling 

• Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE ) 

• Familiar with Lean manufacturing  

• Strong knowledge of SMT Process Flow