Process Engineering

Process Engineering

Job ID:  38844
Job ID:  38844
Date:  2 Apr 2026
Date:  2 Apr 2026
Location: 

Jagiroad, AS, IN

Location: 

Jagiroad, AS, IN

Department:  Assembly Technology Development
Department:  Assembly Technology Development
Business:  TSAT India
Business:  TSAT India

Role Overview: 

SME -   is responsible for overseeing, optimizing & continuously improving  processes to ensure on-time manufacturing with high quality of all ISP Products.  Also to handle end to end machine setup , programming , trouble shooting and process optimization in PCB assembly 

The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams. 

 

Key Responsibilities: 

 

  1. Technology & Process Setup  

  • Define and maintain all process windows, control plans & CTQ across all products of PnP. 

  • Setup, Operate, Programming & Optimizing PnP machines.  

  • Conduct DOE & Process validation for new products and materials. 

  • Perform feeder loading , nozzle selection & calibration. 

  • Optimize component placement accuracy and speed. 

  • Create & modify machine programs using online/offline SW. 

  • Optimize cycle time and improve placement efficiency. 

  • Perform Penalization and coordinate transformation. 

  • Validate BOM , Centroid file and Gerber data before production. 

 

 

  1. New Model Readiness 

  • Develop & Maintain Process documentation, WIs & SOPs (Pick n Place / Mounter) 

  • All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation. 

  • Load & verify machine programs for New Product Trail. 

  • Conduct First Article Inspection. 

  • Partner with NPI, TDG to ensure DFMEA and PFMEA of Pink n Place / Mounter. 

  • Ensure proper solder paste reflow per component and PCB design requirements 

  • Ensure smooth technology transfer from development to production. 

  • Own ramp-up metrics: yield learning curve, cycle time, scrap reduction. 

 

 

  1. Quality Excellence 

  • Accountable for first pass yield, final yield and field reliability. 

  • Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis. 

  • Monitor production yield , defect rates , cycle time and implement corrective / preventive actions. 

  • Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints, misalignment , missing components and solder balls. 

  • Partner with Quality team to address customer returns, audits and escalations. 

  • Analyze following  defects ( Identify root causes of defects like tombstoning , misalignment , missing components etc. ) and implement corrective actions 

  • Monitor Placement Quality and defect rates. 

  • Maintain Process documentation & Production reports. 

 

 

  1.  Operational Excellence & Cost Optimization 

  • Own cost of ownership and productivity improvement initiatives. 

  • Drive Cycle time and line balancing improvements. 

  • Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing ) 

  • To ensure Proper line setup , programming , Program version management ( Pick n Place/Mounter ) 

  • To ensure compliance with ESD , Safety& IPC standards. 

  • Meet daily production targets & OEE goals 

  • Coordinate with production planning , quality & maintenance teams 

  • Diagnose and resolve machine alarms and placement defects 

  • Handle feeder related issues , vision alignment errors & nozzle problems 

  • Minimize downtime & improve machine utilization 

 

 

 

  1. Customer & Stakeholder Engagement 

  • Serve as a technical team member for customers on PCBA Process Topics. 

  • Will be technical team member for customer reviews, technology discussions and risk mitigation plans. 

 

 

Key Deliverables & KPI 

  • First Pass Yield , RTY and Reliability Performance 

  • Productivity Improvement , Production Target Vs Actual Achievement 

  • Cost Optimization 

  • Customer satisfaction and Audit outcomes. 

  • Placement Accuracy 

 

Required Qualifications 

  • Bachelor in related Engineering Discipline (Preferred Electronics Engineering)  

  • 10-12 years’ hands on experience in SMT industry in a similar role ( PnP Programming & Optimization ) 

  • Experience in high volume manufacturing environment. 

  • Hands on knowledge of PnP machines ( ASMPT / Fuji / Panasonic ) 

  • Deep Understanding of solder paste behavior & thermal profiling 

  • Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE ) 

  • Familiar with Lean manufacturing  

  • Strong knowledge of SMT Process Flow 

Role Overview: 

SME -   is responsible for overseeing, optimizing & continuously improving  processes to ensure on-time manufacturing with high quality of all ISP Products.  Also to handle end to end machine setup , programming , trouble shooting and process optimization in PCB assembly 

The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams. 

 

Key Responsibilities: 

 

  1. Technology & Process Setup  

  • Define and maintain all process windows, control plans & CTQ across all products of PnP. 

  • Setup, Operate, Programming & Optimizing PnP machines.  

  • Conduct DOE & Process validation for new products and materials. 

  • Perform feeder loading , nozzle selection & calibration. 

  • Optimize component placement accuracy and speed. 

  • Create & modify machine programs using online/offline SW. 

  • Optimize cycle time and improve placement efficiency. 

  • Perform Penalization and coordinate transformation. 

  • Validate BOM , Centroid file and Gerber data before production. 

 

 

  1. New Model Readiness 

  • Develop & Maintain Process documentation, WIs & SOPs (Pick n Place / Mounter) 

  • All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation. 

  • Load & verify machine programs for New Product Trail. 

  • Conduct First Article Inspection. 

  • Partner with NPI, TDG to ensure DFMEA and PFMEA of Pink n Place / Mounter. 

  • Ensure proper solder paste reflow per component and PCB design requirements 

  • Ensure smooth technology transfer from development to production. 

  • Own ramp-up metrics: yield learning curve, cycle time, scrap reduction. 

 

 

  1. Quality Excellence 

  • Accountable for first pass yield, final yield and field reliability. 

  • Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis. 

  • Monitor production yield , defect rates , cycle time and implement corrective / preventive actions. 

  • Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints, misalignment , missing components and solder balls. 

  • Partner with Quality team to address customer returns, audits and escalations. 

  • Analyze following  defects ( Identify root causes of defects like tombstoning , misalignment , missing components etc. ) and implement corrective actions 

  • Monitor Placement Quality and defect rates. 

  • Maintain Process documentation & Production reports. 

 

 

  1.  Operational Excellence & Cost Optimization 

  • Own cost of ownership and productivity improvement initiatives. 

  • Drive Cycle time and line balancing improvements. 

  • Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing ) 

  • To ensure Proper line setup , programming , Program version management ( Pick n Place/Mounter ) 

  • To ensure compliance with ESD , Safety& IPC standards. 

  • Meet daily production targets & OEE goals 

  • Coordinate with production planning , quality & maintenance teams 

  • Diagnose and resolve machine alarms and placement defects 

  • Handle feeder related issues , vision alignment errors & nozzle problems 

  • Minimize downtime & improve machine utilization 

 

 

 

  1. Customer & Stakeholder Engagement 

  • Serve as a technical team member for customers on PCBA Process Topics. 

  • Will be technical team member for customer reviews, technology discussions and risk mitigation plans. 

 

 

Key Deliverables & KPI 

  • First Pass Yield , RTY and Reliability Performance 

  • Productivity Improvement , Production Target Vs Actual Achievement 

  • Cost Optimization 

  • Customer satisfaction and Audit outcomes. 

  • Placement Accuracy 

 

Required Qualifications 

  • Bachelor in related Engineering Discipline (Preferred Electronics Engineering)  

  • 10-12 years’ hands on experience in SMT industry in a similar role ( PnP Programming & Optimization ) 

  • Experience in high volume manufacturing environment. 

  • Hands on knowledge of PnP machines ( ASMPT / Fuji / Panasonic ) 

  • Deep Understanding of solder paste behavior & thermal profiling 

  • Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE ) 

  • Familiar with Lean manufacturing  

  • Strong knowledge of SMT Process Flow 

Learn More about TATA Electronics

Learn More About Tata Electronics