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Process Engineering SME

Process Engineering SME

Job ID:  39380
Job ID:  39380
Date:  22 May 2026
Date:  22 May 2026
Location: 

Jagiroad, AS, IN

Location: 

Jagiroad, AS, IN

Department:  Assembly Technology Development
Department:  Assembly Technology Development
Business:  TSAT India
Business:  TSAT India

Responsibilities: 

  1. Technology & Process Leadership. 

  • Own end-to-end process integration for 

  • Wafer /Die Preparation (Wafer thinning, Dicing (Laser, Mechanical), 2nd optical Inspection) 

  • Die attach (Direct, Flipchip, Thin die, Epoxy, Film, Sintering) 

  • Wire bond (Au, CuPd, Al, Ball Bond, Wedge Bond) 

  • Underfill, Plasma clean 

  • Taping & 3rd Optical 

  • Encapsulation (Transfer Mold, Compression Mold and Lid attach) 

  • Plating & Marking 

  • Solder ball attach, Reflow and Flux cleaning 

  • Package Separation (Cutting, Forming, Singulation) & FV Inspection. 

  • Define and maintain process windows, control plans and CTQ across all package families. 

  • Lead technology qualification, scaling from development to high volume manufacturing. 

  • Drive technology/process roadmaps aligned to customer, market and package needs. 

 

  1. NPI & Manufacturing Readiness. 

  • Lead EVT/ DVT / PVT readiness from a process perspective. 

  • Partner with NPI, Product Engineering, and TD to ensure DFM and DFR. 

  • Ensure smooth technology transfer from development to production. 

  • Own ramp-up metrics: yield learning curve, cycle time, scrap reduction. 

 

  1. Yield, Reliability & Quality Excellence. 

  • Accountable for first pass yield, final yield and field reliability. 

  • Lead root cause analysis for yield excursions using SPC, FMEA, DOE and failure analysis. 

  • Own JEDEC reliability qualification of the packages/devices. 

  • Partner with Quality team to address customer returns, audits and escalations. 

 

  1. Equipment Supplier Management 

  • Provide technical leadership for process equipment selection, buyoff and productivity improvement. 

  • Support CAPEX planning and ROI justification. 

 

  1. Cost, Productivity & Operational Excellence. 

  • Own cost of ownership and productivity improvement initiatives. 

  • Drive OEE, Cycle time and line balancing improvements. 

  • Lead automation, digitalization and smart manufacturing initiatives. 

  • Support factory expansion and greenfield/ brownfield setups. 
     

  1. Organization and Talent leadership. 

  • Build and lead high performance process engineering organizations including SMEs. 

  • Mentor Senior Engineers and SMEs. 

  • Define competency frameworks, training roadmaps and succession plans. 

  • Foster a culture of technical rigor, accountability, and continuous improvement. 

  • Implement and monitor company values. 

 

  1. Customer & Stakeholder Engagement. 

  • Serve as a technical authority for customers on packaging process topics. 

  • Lead customer reviews, technology discussions and risk mitigation plans. 

  • Support business development with technology feasibility and cost modeling. 

  • Represent process engineering in executive and customer forums. 

Key Deliverables & KPI 

  • Yield and Reliability Performance. 

  • Cost reduction and productivity improvement. 

  • NPI cycle time and ramp success. 

  • Customer satisfaction and audit outcomes. 

  • Talent retention and Capability maturity.

 

 Essential Attributes:

  • Experience in high volume and high package /device mix manufacturing environment. 

  • Demonstrated success in yield improvement, reliability qualification and cost reduction. 

 

Qualification:

  • Bachelor / master in related Engineering Discipline (Preferred Mechanical, Electronics).  

 

Desired Experience Level: 

  • 5-7 years’ experience in OSAT industry in a similar role. 

  • 15-20 years Semiconductor IC Packaging and Assembly. 

Responsibilities: 

  1. Technology & Process Leadership. 

  • Own end-to-end process integration for 

  • Wafer /Die Preparation (Wafer thinning, Dicing (Laser, Mechanical), 2nd optical Inspection) 

  • Die attach (Direct, Flipchip, Thin die, Epoxy, Film, Sintering) 

  • Wire bond (Au, CuPd, Al, Ball Bond, Wedge Bond) 

  • Underfill, Plasma clean 

  • Taping & 3rd Optical 

  • Encapsulation (Transfer Mold, Compression Mold and Lid attach) 

  • Plating & Marking 

  • Solder ball attach, Reflow and Flux cleaning 

  • Package Separation (Cutting, Forming, Singulation) & FV Inspection. 

  • Define and maintain process windows, control plans and CTQ across all package families. 

  • Lead technology qualification, scaling from development to high volume manufacturing. 

  • Drive technology/process roadmaps aligned to customer, market and package needs. 

 

  1. NPI & Manufacturing Readiness. 

  • Lead EVT/ DVT / PVT readiness from a process perspective. 

  • Partner with NPI, Product Engineering, and TD to ensure DFM and DFR. 

  • Ensure smooth technology transfer from development to production. 

  • Own ramp-up metrics: yield learning curve, cycle time, scrap reduction. 

 

  1. Yield, Reliability & Quality Excellence. 

  • Accountable for first pass yield, final yield and field reliability. 

  • Lead root cause analysis for yield excursions using SPC, FMEA, DOE and failure analysis. 

  • Own JEDEC reliability qualification of the packages/devices. 

  • Partner with Quality team to address customer returns, audits and escalations. 

 

  1. Equipment Supplier Management 

  • Provide technical leadership for process equipment selection, buyoff and productivity improvement. 

  • Support CAPEX planning and ROI justification. 

 

  1. Cost, Productivity & Operational Excellence. 

  • Own cost of ownership and productivity improvement initiatives. 

  • Drive OEE, Cycle time and line balancing improvements. 

  • Lead automation, digitalization and smart manufacturing initiatives. 

  • Support factory expansion and greenfield/ brownfield setups. 
     

  1. Organization and Talent leadership. 

  • Build and lead high performance process engineering organizations including SMEs. 

  • Mentor Senior Engineers and SMEs. 

  • Define competency frameworks, training roadmaps and succession plans. 

  • Foster a culture of technical rigor, accountability, and continuous improvement. 

  • Implement and monitor company values. 

 

  1. Customer & Stakeholder Engagement. 

  • Serve as a technical authority for customers on packaging process topics. 

  • Lead customer reviews, technology discussions and risk mitigation plans. 

  • Support business development with technology feasibility and cost modeling. 

  • Represent process engineering in executive and customer forums. 

Key Deliverables & KPI 

  • Yield and Reliability Performance. 

  • Cost reduction and productivity improvement. 

  • NPI cycle time and ramp success. 

  • Customer satisfaction and audit outcomes. 

  • Talent retention and Capability maturity.

 

 Essential Attributes:

  • Experience in high volume and high package /device mix manufacturing environment. 

  • Demonstrated success in yield improvement, reliability qualification and cost reduction. 

 

Qualification:

  • Bachelor / master in related Engineering Discipline (Preferred Mechanical, Electronics).  

 

Desired Experience Level: 

  • 5-7 years’ experience in OSAT industry in a similar role. 

  • 15-20 years Semiconductor IC Packaging and Assembly. 

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