Quality & Reliability Lead

Job Description

The Quality & Reliability Lead will spearhead the establishment and management of an advanced semiconductor and electronics Failure Analysis (FA) and Reliability Laboratory. This role is responsible for building state‑of‑the‑art lab capabilities, defining analysis and reliability methodologies, and supporting cross‑functional teams in identifying and resolving product failures. The ideal candidate brings deep expertise in semiconductor technologies, failure analysis techniques, and proven experience setting up and operating world‑class laboratory facilities.

Key Responsibilities

• Lead the planning, setup, and ongoing management of the semiconductor Failure Analysis and Reliability laboratory, ensuring compliance with industry standards and customer requirements.
• Define, develop, and implement standardized failure analysis protocols, including electrical, thermal, and physical characterization techniques.
• Collaborate with cross‑functional teams (Design, Process, Quality, Manufacturing, and Suppliers) to investigate failures, identify root causes, and deliver comprehensive technical reports.
• Design and execute reliability test strategies for semiconductor devices, including accelerated life testing and environmental stress testing.
• Own documentation of test methods, analysis results, and lab procedures to ensure traceability, repeatability, and compliance with applicable industry standards.
• Interface with equipment and material suppliers to identify, procure, and integrate advanced tools and technologies for semiconductor FA and reliability testing.
• Drive continuous improvement of lab capability, throughput, and analytical depth to support NPI and high‑volume manufacturing needs.

Qualifications & Experience

• Bachelor’s degree in Mechanical Engineering, Chemistry, Materials, Electronics, or a related technical field; Master’s degree preferred.
• Certification in semiconductor failure analysis, reliability engineering, or related disciplines preferred.
• Minimum of 15 years of experience in failure analysis and reliability engineering, including hands‑on experience managing FA and Reliability laboratories.
• Strong understanding of semiconductor fabrication processes, IC packaging technologies, and PCBA assemblies.
• Proven project management capability, with experience planning and executing laboratory setup and expansion projects.
• Strong analytical, communication, and stakeholder‑management skills.