Key Responsibilities

• Deliver practical and theoretical training on IC manufacturing processes such as:
• Wafer handling and preparation
• Die attach, wire bonding, and flip-chip processes
• Encapsulation / molding techniques
• Trimming, forming, and singulation
• Electrical testing, burn-in, and final test
• Train students on semiconductor equipment operation, tool handling, and basic machine troubleshooting.
• Instruct trainees on cleanroom protocols, ESD control, contamination control, and safety practices.
• Demonstrate process flow from wafer to finished IC package and explain yield, defects, and failure modes.
• Conduct hands-on labs, simulations, and process demonstrations as per OSAT curriculum.
• Prepare trainees for OSAT / NSQF-aligned skill assessments through mock tests and skill evaluations.
• Ensure compliance with quality systems such as SPC, SOPs, and basic ISO practices relevant to IC manufacturing.
• Maintain training equipment, ESD stations, and consumables; ensure calibration and readiness.
• Track trainee performance, attendance, and competency development; maintain training documentation.
• Support internal and external assessors during OSAT certification assessments.
• Provide basic orientation on semiconductor industry expectations, shift culture, and shop-floor discipline.
• Coordinate with industry partners, assessment bodies, and placement teams when required.

Required Qualifications

• ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology.
• OSAT / NSQF / Semiconductor Skill Certification preferred.

Experience

• 1–5 years of hands-on experience in IC manufacturing, semiconductor assembly & test, or electronics manufacturing.
• Experience in cleanroom or ESD-controlled environments is highly desirable.
• Training or mentoring experience is an added advantage.

Technical Skills

• Knowledge of semiconductor assembly and test processes.
• Understanding of IC packaging types (DIP, QFN, BGA, CSP, etc.).
• Familiarity with ESD standards, cleanroom protocols, and contamination control.
• Basic understanding of yield, defects, and failure analysis.
• Ability to read process flow diagrams, SOPs, and equipment manuals.
• Basic computer skills for reporting and documentation.

Soft Skills

• Clear communication and demonstration skills.
• Strong discipline and safety-first mindset.
• Patience and ability to train entry-level candidates.
• Willingness to upgrade skills with evolving semiconductor technologies.

Work Environment

• Training labs simulating cleanroom and IC manufacturing environments.
• May require extended hours during assessments or industry-aligned programs.

Key Performance Indicators (KPIs)

• Trainee competency and OSAT assessment success rate.
• Compliance with cleanroom, ESD, and safety standards.
• Equipment uptime and lab readiness.
• Trainee feedback and placement readiness in semiconductor roles.