Wire bond Engineer

Wire bond Engineer

Job ID:  38880
Job ID:  38880
Date:  3 Apr 2026
Date:  3 Apr 2026
Location: 

Jagiroad, AS, IN

Location: 

Jagiroad, AS, IN

Department:  Assembly Technology Development
Department:  Assembly Technology Development
Business:  TSAT India
Business:  TSAT India
As the Lead of Wire Bonding, you will be responsible for overseeing and leading the wire bonding operations within a semiconductor manufacturing facility. Your role involves managing the wire bonders, implementing process improvements, ensuring quality standards, and collaborating with other departments to achieve overall production goals. 
 

·       Extensive experience in wire bonding operations within the semiconductor industry, with a proven track record of leadership.

·       In-depth knowledge of various wire bonding techniques and equipment.

·       Set up and operate wire bonding equipment according to established procedures.

·       Lead and manage the wire bond team, providing guidance, coaching, and support.

·       Foster a collaborative and high-performance work environment within the wire bonding department.

·       Conduct inspections of wire bonds to ensure they meet quality standards and specifications.

·       Troubleshoot and resolve issues related to wire bonding processes, collaborating with CFT teams when necessary to enhance efficiency, quality and yield.

·       Maintain accurate records of production activities, including process parameters, equipment settings, and quality control data.

·       Contribute to the creation and updating of standard operating procedures (SOPs) related to wire bonding processes.

·       Collaborate with engineering teams to implement improvements and innovations in wire bonding technology.

·       Establish and enforce quality control measures for wire bonding operations.

·       Ensure compliance with industry standards and customer specifications.

·       Perform routine maintenance on wire bonding equipment to ensure optimal functionality.

·       Develop and implement strategic plans for the wire bonding department in alignment with overall organizational goals.

·       Identify opportunities for cost savings, productivity enhancements, and technological advancements.

·       Collaborate with other department heads, including engineering, production, and quality assurance, to achieve seamless integration of processes.

·       Communicate effectively with stakeholders to address challenges and optimize workflows.

·       Identify and address skill gaps within the team.

·       Ensure accurate documentation of wire bonding processes, equipment settings, and quality control data.

·       Communicate effectively with team members to address issues and drive continuous improvement.

·       Generate reports on departmental performance and key metrics.

 

 

As the Lead of Wire Bonding, you will be responsible for overseeing and leading the wire bonding operations within a semiconductor manufacturing facility. Your role involves managing the wire bonders, implementing process improvements, ensuring quality standards, and collaborating with other departments to achieve overall production goals. 
 

·       Extensive experience in wire bonding operations within the semiconductor industry, with a proven track record of leadership.

·       In-depth knowledge of various wire bonding techniques and equipment.

·       Set up and operate wire bonding equipment according to established procedures.

·       Lead and manage the wire bond team, providing guidance, coaching, and support.

·       Foster a collaborative and high-performance work environment within the wire bonding department.

·       Conduct inspections of wire bonds to ensure they meet quality standards and specifications.

·       Troubleshoot and resolve issues related to wire bonding processes, collaborating with CFT teams when necessary to enhance efficiency, quality and yield.

·       Maintain accurate records of production activities, including process parameters, equipment settings, and quality control data.

·       Contribute to the creation and updating of standard operating procedures (SOPs) related to wire bonding processes.

·       Collaborate with engineering teams to implement improvements and innovations in wire bonding technology.

·       Establish and enforce quality control measures for wire bonding operations.

·       Ensure compliance with industry standards and customer specifications.

·       Perform routine maintenance on wire bonding equipment to ensure optimal functionality.

·       Develop and implement strategic plans for the wire bonding department in alignment with overall organizational goals.

·       Identify opportunities for cost savings, productivity enhancements, and technological advancements.

·       Collaborate with other department heads, including engineering, production, and quality assurance, to achieve seamless integration of processes.

·       Communicate effectively with stakeholders to address challenges and optimize workflows.

·       Identify and address skill gaps within the team.

·       Ensure accurate documentation of wire bonding processes, equipment settings, and quality control data.

·       Communicate effectively with team members to address issues and drive continuous improvement.

·       Generate reports on departmental performance and key metrics.

 

 

Learn More about TATA Electronics

Learn More About Tata Electronics