About The Business:

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Purpose of the Job:

• This role is responsible for developing cutting-edge, cost-effective packaging solutions for integrated circuits, ensuring optimal performance, reliability, and manufacturability.
• Fully accountable for new product development – design > material selection > qualification > LVM > Offload and process engineer providing end to end technology & process development, covering conventional & advanced packages.
• Able to lead technically the team of experts, to achieve all the deliverables, through flawless execution on the NTI / NPI programs and service the customer timely.

Key Responsibilities:

• Able to be hands-on, in designing DOE, Process characterization & optimization, develop manufacturable recipe meeting all the CTQ matrices & yield.
• Strong understanding of semiconductor packaging materials, processes, and failure mechanisms.
• Must be very familiar and hands-on experience on the TD / NPI methodology, covering all the process involved
• Provide direction, technical leadership and hands-on experience to ensure all different functional dept work in sync to achieve the common dept/org goal.
• Lead, understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution.
• To make a characterization plan and risk assessment for new and existing device requiring engineering support
• Understand systematic problem-solving methodology using qualified tools like ESDA/FMEA/SPC/DOE/MSA etc
• To drive yield and quality improvement
• Responsible for guiding NPI & Process SME’s in resolving yield and quality issues
• Able to define process flows and material sets. Source & characterize material. Develop and execute standard operating procedures (SOPs) and ensure all designs meet quality and industry standards.
• Able to source, characterise & qualify new material required for packaging / technology
• Customer interface – handling TD / engineer activities / quality performance mtgs / manage issues
• Work with TPM / Customer for new NPI design win opportunities & technical issues.
• To drive material cost reduction programs, through value engineer program.
• Able to cohesively co-work with all supporting groups & operations team.

Essential Attributes:

• All aspects of this job are NTI & Assembly Process Engineering plant wide, affecting operations.
• In depth know-how of DOE/SPC/FMEA/MSA/JMP and other problem-solving methodology tools.
• Proven record in process stabilization, yield improvement and high-volume manufacturing support.

Qualifications:

• Degree in Engineering or its equivalent.

Desired Experience Level:

• Minimum 15 years of experience in TD Development, Assembly Process Engineering, in a multinational OSAT industry.
• Knowledgeable in package assembly process equipment & manufacturing.
• Knowledge in APQP standards and Automotive standards.
• Experience in leading a group or team of employees in the achievement of organizational goals is mandatory. Added advantage if both start-up and HVM experienced.