Key Responsibilities:

• Imaging using optical microscopes and SEM (Scanning Electron Microscopy) for data curation and failure analysis.
• Perform cross-sectioning of semiconductor devices to analyse internal structures and identify failure mechanisms.
• Operate C-SAM (C-mode Scanning Acoustic Microscopy) for non-destructive inspection of package integrity.
• Perform laser decapsulation and chemical decapsulation to expose die surfaces for failure analysis/data curation.
• Conduct routine maintenance of laboratory equipment to ensure optimal performance and accuracy.
• Maintain 5S standards in the lab to ensure a clean, organized, and efficient working environment.
• Document and report findings clearly and accurately for further review and decision-making.

Qualifications:

• Bachelor’s degree/ Diploma or equivalent in Electronics, Materials Science, or a related field.
• Experience as a Failure Analysis Technician or in a similar role within the semiconductor industry is preferred.
• Hands-on experience with optical microscopes, SEM, C-SAM, laser decapsulation, and chemical decapsulation is preferred.
• Ability to work independently and as part of a team in a fast-paced environment.
• Strong communication and documentation skills.