Process Die Preparation SME

Process Die Preparation SME

Job ID:  39231
Job ID:  39231
Date:  29 May 2026
Date:  29 May 2026
Location: 

Jagiroad, AS, IN

Location: 

Jagiroad, AS, IN

Department:  Assembly Technology Development
Department:  Assembly Technology Development
Business:  TSAT India
Business:  TSAT India

RESPONSIBILITIES: 

 

  • Establish knowledge of metrology processes, controls, criteria and specifications in Die Prep process station. 

  • Collaborate with manufacturing and equipment engineering team to ensure compliance with the process requirements and specifications. 

  • Share the extensive knowledge on the techniques and methods, quality monitoring and process performance indicators on the assigned station through hands-on training of line personnel. 

  • Address quality issue through strong troubleshooting skill, analytical, and interpersonal communication to provide proper product disposition and communicate with stakeholder . 

  • Lead the internal quality issue resolution and product disposition, champion the customer audit preparation on the assigned station. 

  • Drive cost saving projects through improve yield, UPH improvement, wastage, and cost-effective process consumables, and process optimization to reduce utility consumption. 

  • Drive process capability, upgrade, reusability, sustainability, and process stability. 

  • Define BKM and SOP for sustainable process engineering. Process monitoring through SPC and CPK on the assigned station 

  • Cultivate engineering step functional improvement for quality, reliability & yield targets, and status-quo challenges. 

  • Support process monitoring system automation drives for NVA reduction, quality issue prevention and implement less human dependent process. Includes auto gate vision inspection, process step simplification, streamline the process flow, and etc. 

  • Support prototype and development sample engineering build monitoring and data gathering on the assigned station. 

  • Update relevant documents, e.g. Process Specification, PFMEA, Control plan, Procedures and SOP in the event of procedure discrepancy, quality issue corrective action, process improvement implementation, customer audit findings closure, and etc. 

  • Always initiate the problem-solving using statistical and analytical tools, eg SPC, DOE, 8D, and etc. on the assigned station. 

  • Support the definition of process technology, material, machine and tooling in compliance to standard process/customer requirements. 

  • Provide regular feedback/update as required by supervisor and open to other duties may be assigned from time to time. 

 

Education:  

 

  • Masters/bachelor’s degree in engineering or relevant course. 

 

Experience & Skill: 

 

  • Minimum 10years working experience in semiconductor packaging industry. 

  • Strong hands-on knowledge and skills on the assigned station 

  • Statistical data analysis, analytical and problem-solving skills. 

  • Knowledge & experiences in FOL process flow and each sub-station. 

 

RESPONSIBILITIES: 

 

  • Establish knowledge of metrology processes, controls, criteria and specifications in Die Prep process station. 

  • Collaborate with manufacturing and equipment engineering team to ensure compliance with the process requirements and specifications. 

  • Share the extensive knowledge on the techniques and methods, quality monitoring and process performance indicators on the assigned station through hands-on training of line personnel. 

  • Address quality issue through strong troubleshooting skill, analytical, and interpersonal communication to provide proper product disposition and communicate with stakeholder . 

  • Lead the internal quality issue resolution and product disposition, champion the customer audit preparation on the assigned station. 

  • Drive cost saving projects through improve yield, UPH improvement, wastage, and cost-effective process consumables, and process optimization to reduce utility consumption. 

  • Drive process capability, upgrade, reusability, sustainability, and process stability. 

  • Define BKM and SOP for sustainable process engineering. Process monitoring through SPC and CPK on the assigned station 

  • Cultivate engineering step functional improvement for quality, reliability & yield targets, and status-quo challenges. 

  • Support process monitoring system automation drives for NVA reduction, quality issue prevention and implement less human dependent process. Includes auto gate vision inspection, process step simplification, streamline the process flow, and etc. 

  • Support prototype and development sample engineering build monitoring and data gathering on the assigned station. 

  • Update relevant documents, e.g. Process Specification, PFMEA, Control plan, Procedures and SOP in the event of procedure discrepancy, quality issue corrective action, process improvement implementation, customer audit findings closure, and etc. 

  • Always initiate the problem-solving using statistical and analytical tools, eg SPC, DOE, 8D, and etc. on the assigned station. 

  • Support the definition of process technology, material, machine and tooling in compliance to standard process/customer requirements. 

  • Provide regular feedback/update as required by supervisor and open to other duties may be assigned from time to time. 

 

Education:  

 

  • Masters/bachelor’s degree in engineering or relevant course. 

 

Experience & Skill: 

 

  • Minimum 10years working experience in semiconductor packaging industry. 

  • Strong hands-on knowledge and skills on the assigned station 

  • Statistical data analysis, analytical and problem-solving skills. 

  • Knowledge & experiences in FOL process flow and each sub-station. 

 

Learn More about TATA Electronics

Learn More About Tata Electronics