RESPONSIBILITIES: 

• Develop and maintain deep understanding of molding materials, equipment parameters, and process controls in Transfer Molding and Post-Mold Cure stations. 

• Monitor, analyze, and improve process performance indicators such as yield, OEE, UPH, and scrap rate for molding operations. 

• Drive quality issue resolution through structured problem-solving methodologies (8D, 5 Whys, DOE, SPC). 

• Collaborate with equipment engineering and production teams to ensure alignment with product and customer specifications. 

• Actively lead process troubleshooting and implement robust corrective/preventive actions to avoid recurrence of quality issues. 

• Spearhead cost reduction activities through material utilization improvement, automation, cycle time reduction, and process optimization. 

• Champion process capability improvements, ensure CPK/SPC monitoring, and maintain process stability. 

• Support customer audits and take ownership in audit preparation, response, and closure of findings related to the molding process. 

• Define and update SOPs, BKM (Best Known Methods), PFMEA, Control Plans, and Work Instructions to ensure process documentation integrity and compliance. 

• Drive automation and digital transformation in molding processes—such as auto mold vision inspection, predictive maintenance triggers, and reduction of human dependency. 

• Support NPI (New Product Introduction) builds, including tool qualifications, molding parameter development, and data gathering for engineering evaluations. 

• Provide process knowledge sharing and training to technicians and operators to uplift line performance and minimize process variation. 

• Coordinate with global teams to benchmark molding process technologies and deploy global best practices. 

Education:  

• Bachelor’s degree in Mechanical, Materials, Electronics Engineering or a related field. 

Experience & Skill: 

• Minimum of 3 to 5 years of working experience and, preferably in Transfer Molding /EOL processes of Semiconductor packaging. 

• Hands-on experience with transfer molding machines, mold tools, and associated metrology systems. 

• Strong analytical and statistical skills (SPC, Minitab, JMP, etc.). 

• Familiarity with EOL process flow and interdependencies between molding, PMC, laser marking, singulation and final test. 

• Proven experience in process optimization, problem-solving, and cross-functional collaboration.