About The Business:

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Responsibilities:

• Responsible for the technology and process development for the Flip Chip product packaging engineer.

FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Flux less, Flux Cleaning, Plasma Clean, Underfill and

EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.

• Understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution.
• Initiate and engage in technical discussion with vendors to gather all relevant data, review and complete the initial analysis for final decision submission.
• Involvement in the selection of 4Ms based on latest performance and previous experience/learnings.
• Install, buy-off and qualify the given processes and products for development, NPI and LVM.
• Continuous Strive for meeting highest degree of packaging difficulty, ease of DFM to meet BEST customer desired outputs, best in class Yield, best Quality in the industry.
• Offer wide range of BOM selection to cater to different customer requirement.
• Execution of multiple department projects.
• Identify all process controls requirements and use the BKM for inputs & outputs data gathering/controls.

Essential Attributes:

• Exposure in MS office, 8D writing, DOE, SPC, FMEA, OCAP and Control Plan.
• Passionate in achieving what’s not possible via innovation and continuous learning.

Qualifications:

• A minimum relevant engineering or Science degree.

Desired Experience Level:

• Minimum of 4 years of total experience for Sr Engineer and 10 years for Manager.
• Experience in leading a group or team of employees in the achievement of organizational goals.