About The Business

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Responsibilities

• Responsible for the development of materials required for OSAT Package Technology Development
• Expertise in understanding semiconductor package materials, equipment and processes and have an established wide network of suppliers and contacts in the industry.
• Need to work closely with development teams to develop the most profitable packaging solutions with right material selection.
• Evaluate and select materials for packaging, focusing on their compatibility with the packaging technology, while considering cost constraints.
• Knowledge and experience in managing die to package interactions.
• Drive cost reduction programs and yield improvement programs
• Identifying industry packaging trends, working with the Business Units to develop the required materials.
• Liaise with materials and equipment suppliers, understand and influence roadmaps and narrow down packaging solutions & drive competitive analysis.
• Able to quickly become acquainted with new topics and build lasting relationships with the Cross-functional teams and external counterparts.
• Knowledge in materials characterization and analysis
• General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
• Good program management skills.

Essential Attributes

• Good understanding of Advanced Packaging architecture and semiconductor packaging process flow.
• Knowledge on Packaging Assembly Process (Back Grinding, Dicing, Die Attach, Wire Bonding, Moulding, P&P, Ball Attach, Trim & Form, Singulation).
• Ability to work well in a cross-functional environment on challenging projects.
• Experience in package material characteristics and interfacial bonding.
• Able to perform independent research and development work.
• Excellent written and verbal communication skills with ability to present ideas, design concepts, data and plan with high confidence at team meetings.

Qualifications

• Bachelor or Master Degree in chemical, Mechanical, or Materials Science Engineering.

Desired Experience Level

• Minimum 5 to 10 years of experience in semiconductor package simulations.